Molding Compounds for Semiconductor Encapsulation
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Composition of epoxy encapsulation is epoxy resin and silica filler etc. And is used as an encapsulation of package material for the purpose of mainly protecting a semiconductor from environment, such as light and heat, and humidity. We can supply many products to meet various needs with an intense change.B |
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| RYODEN KASEI CO.,LTD | |
| Sanyu Rec Co.,Ltd. | e |
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| Hitachi Chemical Co.,Ltd | |
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| MEIDEN CHEMICAL CO., LTD. | |
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